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For the semiconductor segment, we provide manufacturing services comprising precision machining and sub-assembly services to backend semi-conductor equipment. Specifically, we provide manufacturing services for instruments and mechanical components within the backend equipment such as wire-bonders and chambers. For this sector, we cover the large platform, larger components, automatic equipment-related parts as well as provide the modular sub-assembly services for wire-bonders and chambers.

In the fast-paced semiconductor industry, our one-stop approach to manufacturing helps our customers achieve cost effectiveness and better time-to-market.

“Precision machining is our specialty and the “heart” of our manufacturing services.”

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